Laser dicing equipment
Laser dicing equipment separates chips with a laser instead of a blade. Ablation removes material along the street, while stealth dicing focuses the laser inside the wafer to form a modified layer and the chips are then separated by expanding the tape.
What it does
Lasers are used for thin wafers, brittle materials, low-k wiring layers that chip easily under a blade, and for grooving before blade dicing. Related tools separate the chips and the die attach film after stealth dicing.
Products (9)
- DDS2030 · DISCO
A die separator that uses roller scanning to separate wafers after stealth dicing at high throughput.
- DDS2300 · DISCO
A die separator that cleanly separates thin wafers with DAF by cool expansion. It is also used for separation after stealth dicing.
- DFL7160 · DISCO
A fully automatic 300 mm laser saw known for non-thermal processing with a pulsed laser. It is widely used for full cutting of GaAs and DAF cutting after DBG.
- DFL7262 · DISCO
DISCO's standard 300 mm laser saw that can carry an ultrashort-pulse laser. It is used for grooving low-k wiring layers and full cutting of composite structures.
- DFL7341 · DISCO
A 200 mm stealth dicing laser saw with high productivity for sapphire, LT and MEMS. It is a fully dry process that uses no water.
- DFL7362 · DISCO
DISCO's laser saw using stealth dicing (SD), which focuses the laser inside the wafer to form a modified layer. Throughput is 30% higher than the previous DFL7361.
- DFL7362FH · DISCO
A frame-transfer-only stealth dicing tool that quickly singulates ultra-thin silicon of 50 µm or less with high die strength.
- DFL7560L · DISCO
A fully automatic laser lift-off system using a DPSS laser. It uses a laser to separate a material layer from its substrate, for applications such as micro LED.
- DFL7562 · DISCO
A multi-use 300 mm laser saw that can be fitted with either fixed optics or scanning optics.
Japanese makers in this category
- DISCO · 9 product(s) listed
Other back-end equipment
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- Backgrinders (9)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
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- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
- TSV formation equipment (4)
Sources
Related calculators
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Last updated: October 23, 2026