FPA-3030i6
An i-line stepper for small substrates of 200 mm and below. A new high-transmittance lens reduces aberration and raises throughput to 130 wafers per hour.
Maker: Canon · Official product page
Specifications
| Resolution | 0.35 µm or less |
|---|---|
| NA | 0.30 to 0.63 (selectable) |
| Wafers per batch | 130 wafers per hour (8 inch) |
Specifications as published by the maker. See the sources below.
Overview
FPA-3030i6 is Canon's i-line stepper for small substrates of 200 mm and below. A newly developed projection lens with high transmittance and high durability reduces aberration and raises productivity.
High-transmittance lens glass cuts lens aberration caused by exposure to 1/2 or less of the earlier FPA-3030i5a, shortening exposure time while keeping high contrast even at high illuminance. The lens is also highly durable, so transmittance and productivity are less likely to fall over long use. Throughput has risen from 123 to 130 wafers per hour (8 inch).
It handles not only Si but also compound semiconductor wafers such as SiC and GaN, and the NA range has been widened to 0.30 to 0.63. An optional transfer system flexibly handles 2 to 8-inch substrates, materials such as GaAs and sapphire, and different thicknesses and warpage, and it is used to manufacture power devices and green devices.
Key features
- New high-transmittance lens
- Aberration cut to 1/2 or less of the earlier tool
- 130 wafers per hour
- Supports SiC and GaN
Applications
- Power devices
- Exposure of compound semiconductors
Other i-line steppers
- FPA-3030i5a · Canon
- FPA-3030iWa · Canon
- FPA-5550iX · Canon
- FPA-5550iZ2 · Canon
- NSR-2205iL1 · Nikon
- NSR-SF155 · Nikon
More from Canon
- FPA-1200NZ2C · Nanoimprint lithography (NIL)
- FPA-3030EX6 · DUV lithography systems
- FPA-5520iV · Wafer-level packaging equipment
- FPA-6300ES6a · DUV lithography systems
- FPA-6300ESW · DUV lithography systems
- FPA-8000iW · Wafer-level packaging equipment
Sources
Last updated: October 23, 2026