FPA-5520iV
An i-line stepper for advanced packaging such as FOWLP. It reliably transfers heavily warped reconstituted substrates.
Maker: Canon · Official product page
Specifications
| Target | Reconstituted substrates for FOWLP |
|---|---|
| Handling | Flexible pads that deform to match warpage |
| Options | HR (high resolution), LF / LF2 (wide field) |
Specifications as published by the maker. See the sources below.
Overview
FPA-5520iV is Canon's i-line stepper for advanced packaging. Options include HR for high resolution and LF and LF2 for a wide field.
FOWLP (fan-out wafer-level packaging), which can make thin SiPs that combine chips with different functions in one package, is drawing attention. In FOWLP, wiring is patterned on a reconstituted substrate made by rearranging singulated chips and molding them in resin into a wafer shape. In volume production, the challenges are transferring highly deformed substrates, keeping them flat on the stage and coping with variation in chip placement.
A transfer system with flexible pads whose suction surfaces deform to match substrate warpage, Canon's own chucking system with much stronger suction across the whole substrate, and an alignment scope with about twice the field of view of the earlier tool solve these challenges.
Key features
- Transfer of warped reconstituted substrates
- Full-surface chucking for flatness
- Alignment with about twice the field of view
Applications
- Redistribution patterning for FOWLP
- SiP
Other wafer-level packaging equipment
- FPA-8000iW · Canon
- DAS8930 · DISCO
- DFS8960 · DISCO
More from Canon
- FPA-1200NZ2C · Nanoimprint lithography (NIL)
- FPA-3030EX6 · DUV lithography systems
- FPA-3030i5a · i-line steppers
- FPA-3030i6 · i-line steppers
- FPA-3030iWa · i-line steppers
- FPA-5550iX · i-line steppers
- FPA-5550iZ2 · i-line steppers
- FPA-6300ES6a · DUV lithography systems
Sources
Wafer-level packaging equipment
Last updated: October 23, 2026