FPA-5550iX
An i-line stepper for the front end that combines high resolution of 0.5 µm with a wide 50 × 50 mm field.
Maker: Canon · Official product page
Specifications
| Resolution | 0.5 µm |
|---|---|
| Field size | 50 × 50 mm |
| Alignment | Bright-field and dark-field detection, infrared backside alignment (optional) |
Specifications as published by the maker. See the sources below.
Overview
FPA-5550iX is Canon's wide-field, high-resolution i-line stepper for the front end. It carries over the projection lens of the earlier FPA-5510iX to achieve high resolution of 0.5 µm and exposes a wide 50 × 50 mm field.
It can expose in one shot, with high definition, the wide fields required for full-size CMOS sensors and next-generation XR displays. The projection lens manufacturing method has been renewed for stable supply at high quality.
The alignment scope adds dark-field detection, which measures scattered and diffracted light, to bright-field detection, which measures direct light, so low-contrast marks can also be measured. Optionally, an infrared wavelength that passes through silicon can be chosen for the backside alignment needed to make backside-illuminated sensors. Working with Canon's Lithography Plus solution platform, it also achieves high uptime.
Key features
- High resolution of 0.5 µm
- Wide 50 × 50 mm field
- Bright-field and dark-field alignment
- Works with Lithography Plus
Applications
- Full-size CMOS sensors
- XR displays
Other i-line steppers
- FPA-3030i5a · Canon
- FPA-3030i6 · Canon
- FPA-3030iWa · Canon
- FPA-5550iZ2 · Canon
- NSR-2205iL1 · Nikon
- NSR-SF155 · Nikon
More from Canon
- FPA-1200NZ2C · Nanoimprint lithography (NIL)
- FPA-3030EX6 · DUV lithography systems
- FPA-5520iV · Wafer-level packaging equipment
- FPA-6300ES6a · DUV lithography systems
- FPA-6300ESW · DUV lithography systems
- FPA-8000iW · Wafer-level packaging equipment
Sources
Last updated: October 23, 2026