FPA-3030i5a
An i-line stepper for small substrates that handles 50 to 200 mm wafers, with about 17% higher productivity and about 20% lower power consumption.
Maker: Canon · Official product page
Specifications
| Wafer size | 50 to 200 mm |
|---|---|
| Productivity | About 17% higher than the earlier tool (8 inch) |
| Power consumption | About 20% lower than the earlier tool |
Specifications as published by the maker. See the sources below.
Overview
FPA-3030i5a is Canon's i-line stepper for small substrates of 200 mm and below. It supports manufacturing of many semiconductor devices and lowers cost of ownership (CoO).
A wafer transfer system selectable from 50 mm (2 inch) to 200 mm (8 inch) handles many kinds of wafers, including compound semiconductors.
A new alignment scope that measures alignment marks without going through the projection lens allows measurement across a wide range of wavelengths and in dark field, making the process more robust. Backside alignment (TSA) is available as an option. Renewed hardware and software raise productivity by about 17% over the earlier FPA-3030i5+, and a change in chamber temperature control cuts power consumption by about 20%.
Key features
- Supports 50 to 200 mm
- About 17% higher productivity
- About 20% lower power consumption
- Backside alignment (optional)
Applications
- Exposure of compound semiconductors and power devices
Other i-line steppers
- FPA-3030i6 · Canon
- FPA-3030iWa · Canon
- FPA-5550iX · Canon
- FPA-5550iZ2 · Canon
- NSR-2205iL1 · Nikon
- NSR-SF155 · Nikon
More from Canon
- FPA-1200NZ2C · Nanoimprint lithography (NIL)
- FPA-3030EX6 · DUV lithography systems
- FPA-5520iV · Wafer-level packaging equipment
- FPA-6300ES6a · DUV lithography systems
- FPA-6300ESW · DUV lithography systems
- FPA-8000iW · Wafer-level packaging equipment
Sources
Last updated: October 23, 2026