DUV lithography systems

FPA-3030EX6

Canon's KrF stepper for IoT-related devices. It handles a variety of 100 to 200 mm substrates and shares its wafer transfer system with the FPA-3030i5+ i-line stepper.

Maker: Canon · Official product page

Specifications


Light sourceKrF (248 nm)
Numerical aperture (NA)0.65 to 0.50 (automatically variable)
Resolution150 nm or less
Throughput121 wafers per hour or more
Overlay accuracy25 nm or less
Wafer size100 / 125 / 150 / 200 mm (selectable)

Specifications as published by the maker. See the sources below.

Overview


FPA-3030EX6 is Canon's KrF stepper for IoT-related devices. The exposure wavelength is 248 nm (KrF), the reduction ratio 1:5 and the reticle 6 inch. Resolution is 150 nm or less, which Canon describes as top-level performance for a KrF excimer laser stepper in its class.

NA is automatically variable from 0.65 to 0.50, the field size is 22 × 22 mm, overlay accuracy is 25 nm or less and productivity is 121 wafers per hour or more. Wafer size can be chosen from 100, 125, 150 and 200 mm.

It keeps the performance of the earlier FPA-3000EX6 and adds the wafer transfer system shared with the proven FPA-3030i5+ i-line stepper, allowing it to transfer substrates of many materials, diameters and thicknesses. It is suited to manufacturing IoT devices, which involve many product types on small-diameter lines.

Key features


Applications


Other duv lithography systems


All duv lithography systems and Japanese suppliers

More from Canon


Sources


  1. Canon: FPA-3030EX6 product page

More on this topic


DUV lithography systems

Last updated: October 23, 2026