FPA-5550iZ2
Canon's i-line stepper for the front end. It offers productivity and overlay accuracy among the best for i-line tools and handles 200 and 300 mm wafers.
Maker: Canon · Official product page
Specifications
| Light source | i-line (365 nm) |
|---|---|
| Numerical aperture (NA) | 0.57 to 0.45 (automatically variable) |
| Resolution | 350 nm or less |
| Overlay accuracy | SMO 18 nm or less, MMO 25 nm or less (with options) |
| Wafer size | 200 / 300 mm (selectable) |
| Related models | FPA-5550iZ (previous model; about 20% higher throughput) |
Specifications as published by the maker. See the sources below.
Overview
FPA-5550iZ2 is Canon's i-line stepper for the front end. It offers productivity and overlay accuracy among the best for i-line tools, and either 200 mm or 300 mm wafers can be chosen.
Resolution is 350 nm or less, NA is automatically variable from 0.57 to 0.45, the reduction ratio is 1:4 and the field size is 26 × 33 mm. Overlay accuracy is SMO (single machine) 18 nm or less and MMO 25 nm or less (with options).
Optimized alignment, exposure and wafer transfer sequences shorten wafer processing time, and faster measurement and calibration shorten lot change time. Throughput is about 20% higher than the first unit of the earlier FPA-5550iZ.
Key features
- i-line, resolution of 350 nm or less, 26 × 33 mm field
- Overlay of SMO 18 nm or less and MMO 25 nm or less
- Sequence optimization raises throughput by about 20% over FPA-5550iZ
- Supports 200/300 mm wafers
Applications
- Non-critical layers of logic and memory
- Volume production of image sensors, power devices and others
Other i-line steppers
- FPA-3030i5a · Canon
- FPA-3030i6 · Canon
- FPA-3030iWa · Canon
- FPA-5550iX · Canon
- NSR-2205iL1 · Nikon
- NSR-SF155 · Nikon
More from Canon
- FPA-1200NZ2C · Nanoimprint lithography (NIL)
- FPA-3030EX6 · DUV lithography systems
- FPA-5520iV · Wafer-level packaging equipment
- FPA-6300ES6a · DUV lithography systems
- FPA-6300ESW · DUV lithography systems
- FPA-8000iW · Wafer-level packaging equipment
Sources
Last updated: October 23, 2026