Package substrates (FC-BGA)
FC-BGA substrates
Kyocera's build-up organic packages for high-end flip-chip LSIs with more than 9,000 I/O pins.
Maker: Kyocera · Official product page
Specifications
| Substrate structure | Build-up (FC-BGA) |
|---|---|
| Interconnect formation | Fine design rules (9,000 or more I/O pins) |
| Main applications | Data centers, 5G base stations, network equipment |
Specifications as published by the maker. See the sources below.
Overview
Kyocera's FC-BGA substrates are organic package substrates with a build-up structure. They support high-end flip-chip LSIs with more than 9,000 input/output (I/O) pins.
Layer structures go up to 10-n-10, and wiring line/space is 9/12 µm. They are used for semiconductors in data centers, 5G base stations and network equipment.
Key features
- Supports more than 9,000 I/O pins
- Build-up structures up to 10-n-10
- Line/space of 9/12 µm
Applications
- Data centers
- 5G base stations and network equipment
Other package substrates (fc-bga)
- FC-BGA substrates · IBIDEN
- DLL® / DLL3® (flip-chip package substrates) · Shinko Electric Industries
- FC-BGA substrates · Toppan
Sources
Package substrates (FC-BGA)
Last updated: October 23, 2026