Package substrates (FC-BGA)
FC-BGA substrates
Ibiden's IC package substrates for flip chips, combining fine wiring by SAP with small-diameter microvias made by laser drilling and plating.
Maker: IBIDEN · Official product page
Specifications
| Substrate structure | Build-up (FC-BGA) |
|---|---|
| Interconnect formation | Semi-additive process (SAP), small-diameter microvias |
| Main applications | CPUs, GPUs, AI accelerators |
Specifications as published by the maker. See the sources below.
Overview
Ibiden's FC-BGA substrates are IC package substrates for high-performance semiconductors mounted as flip chips.
Fine wiring is made by the semi-additive process (SAP), and small-diameter microvias are formed by laser drilling and plating. They are used for CPUs, GPUs, AI accelerators and similar devices.
Key features
- Fine wiring by SAP
- Small-diameter microvias by laser drilling and plating
Applications
- CPUs and GPUs
- AI accelerators
Other package substrates (fc-bga)
- FC-BGA substrates · Kyocera
- DLL® / DLL3® (flip-chip package substrates) · Shinko Electric Industries
- FC-BGA substrates · Toppan
Sources
Package substrates (FC-BGA)
Last updated: October 23, 2026