Package substrates (FC-BGA)
FC-BGA substrates
TOPPAN's package substrates for flip-chip BGAs.
Maker: Toppan · Official product page
Specifications
| Substrate structure | Build-up (FC-BGA) |
|---|---|
| Main applications | Flip-chip mounting of high-performance semiconductors |
Specifications as published by the maker. See the sources below.
Overview
TOPPAN's FC-BGA substrates are package substrates for flip-chip BGAs.
Wiring with line/space of 10/10 µm is formed by SAP, and the flip-chip bump pitch is 110 µm. Coreless products without a core and products for 2.3D/2.5D packages are also available.
Key features
- Line/space of 10/10 µm by SAP
- FC bump pitch of 110 µm
- Coreless and 2.3D/2.5D products
Applications
- Flip-chip mounting of high-performance semiconductors
- 2.3D/2.5D packages
Other package substrates (fc-bga)
- FC-BGA substrates · IBIDEN
- FC-BGA substrates · Kyocera
- DLL® / DLL3® (flip-chip package substrates) · Shinko Electric Industries
Sources
Package substrates (FC-BGA)
Last updated: October 23, 2026