DSP-100

Specifications

Specifications as published by the maker. See the sources below.

Overview

DSP-100 is Nikon's digital lithography system for advanced packaging in the back end. It combines the high-resolution technology of Nikon's semiconductor lithography systems with the high productivity of the multi-lens technology in its FPD lithography systems, achieving 1.0 µm L/S resolution and support for large 600 mm square substrates.

Typical lithography tools use photomasks, but DSP-100 shines light on an SLM (spatial light modulator) that displays the circuit pattern and transfers it to the substrate through a projection lens. It is not limited by photomask size and can handle large packages, and because no masks need to be made, development and manufacturing costs and lead times are also reduced.

Overlay accuracy is ±0.3 µm or less, and throughput is 50 panels per hour (510 × 515 mm substrates). Using rectangular substrates gives 9 times the productivity per substrate compared with a 300 mm wafer for large 100 mm square packages. It also accurately corrects substrate warpage and deformation, which are important in advanced packaging.

Key features

• Maskless digital exposure
• 1.0 µm L/S
• 600 × 600 mm rectangular substrates
• 50 panels per hour

Applications

• Panel-level packaging
• Large advanced packages

Other laser direct imaging systems

• DW-3100 · SCREEN Holdings

More from Nikon

• AMI-5700 · Macro inspection equipment
• Litho Booster · Overlay metrology
• NSR-2205iL1 · i-line steppers
• NSR-S215D · DUV lithography systems
• NSR-S220D · DUV lithography systems
• NSR-S322F · DUV lithography systems
• NSR-S333F · DUV lithography systems
• NSR-S625E · DUV lithography systems

Sources

1. Nikon: DSP-100 product page

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