Laser direct imaging systems
DW-3100
A maskless direct imaging system for advanced packaging with resolution below 1 µm, using SCREEN's own GLV imaging head.
Maker: SCREEN Holdings · Official product page
Specifications
| Type | Maskless direct imaging (GLV imaging head) |
|---|---|
| Resolution | 1 µm or less |
| Supported substrates | Wafers, rectangular panels (version for PLP available) |
Specifications as published by the maker. See the sources below.
Overview
DW-3100 is SCREEN's direct imaging system for advanced packaging. It meets the diverse needs of advanced packaging without masks, combining high definition with high productivity.
An in-house GLV (Grating Light Valve) imaging head and optical system achieve resolution of 1 µm or less, among the best in the world.
It supports 3 types of alignment: global, local and die-by-die. Versions for wafers and for rectangular panels can be chosen to suit the manufacturing process.
Key features
- GLV imaging head
- Resolution of 1 µm or less
- 3 types of alignment
- Wafer or panel versions
Applications
- Redistribution layer patterning for advanced packaging
- Panel-level packaging
Other laser direct imaging systems
- DSP-100 · Nikon
More from SCREEN Holdings
- CW-2000 · Batch wafer cleaning equipment
- DR-8000 · Mask dimension and flatness metrology
- DT-3000 (SOKUDO DUO) · Coater/developers
- FC-3100 · Batch wafer cleaning equipment
- FC-821L · Batch wafer cleaning equipment
- LA-3100 · Laser annealing equipment
- RE-3500 · Ellipsometers
- RF-200EX / RF-300EX · Coater/developers
Sources
Front-end equipment: more products
Last updated: October 23, 2026