PVD equipment
PVD (physical vapor deposition) equipment deposits films by physically transferring material, most often by sputtering a target with ions, rather than by chemical reaction. It is the main method for metal films such as aluminum, copper seed layers, titanium, tantalum and their nitrides.
What it does
Production PVD systems are multi-chamber platforms that combine pre-clean, degas, deposition and cooling modules around a central transfer chamber, and are also used for magnetic stacks in MRAM and for films in advanced packaging.
Products (4)
- EXIM™ · Tokyo Electron (TEL)
TEL's PVD system that deposits ultra-multilayer films such as those for STT-MRAM with high productivity. Process modules can be arranged freely.
- LEXIA™-EX · Tokyo Electron (TEL)
Tokyo Electron's multi-cathode PVD system for 300 mm wafers. It handles films from MTJs (magnetic tunnel junctions) and metals to hard masks for DRAM capacitors.
- ENTRON-EX W300 · ULVAC
A multi-chamber sputtering system qualified at many volume fabs. It is the earlier model before ENTRON-EXX.
- ENTRON-EXX · ULVAC
ULVAC's multi-chamber deposition system. The successor to ENTRON-EX W300, it carries up to 12 PVD, pre-clean, heating and cooling modules.
Japanese makers in this category
- Tokyo Electron (TEL) · 2 product(s) listed
- ULVAC · 2 product(s) listed
Other front-end equipment
Sources
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Last updated: October 23, 2026