FPA-8000iW
An i-line stepper for panel-level packaging that handles large 515 × 510 mm rectangular substrates with 1.0 µm resolution.
Maker: Canon · Official product page
Specifications
| Resolution | 1.0 µm or less |
|---|---|
| Substrate size | 515 × 510 mm (up to 515 × 515 mm) |
| Field size | 52 × 68 mm or 55 × 65 mm |
Specifications as published by the maker. See the sources below.
Overview
FPA-8000iW is Canon's i-line stepper for large rectangular substrates. It handles large rectangular substrates up to 515 × 510 mm while achieving 1.0 µm resolution.
To meet the needs of packaging processes that use rectangular substrates, Canon developed a new platform that can transfer large 515 × 510 mm substrates. A new transfer system also copes with warpage of up to 10 mm, which large rectangular substrates are prone to. This enables panel-level packaging (PLP), which can produce large chips efficiently.
Canon's own projection optics support a wide 52 × 68 mm field while achieving 1.0 µm resolution, the best among packaging lithography tools for rectangular substrates. This enables advanced packaging for more highly integrated, thinner chips.
Key features
- Large 515 × 510 mm rectangular substrates
- Resolution of 1.0 µm
- Handles warpage of up to 10 mm
Applications
- Panel-level packaging (PLP)
Also listed under: Panel-level packaging (FOPLP) equipment
Other wafer-level packaging equipment
- FPA-5520iV · Canon
- DAS8930 · DISCO
- DFS8960 · DISCO
More from Canon
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- FPA-3030EX6 · DUV lithography systems
- FPA-3030i5a · i-line steppers
- FPA-3030i6 · i-line steppers
- FPA-3030iWa · i-line steppers
- FPA-5550iX · i-line steppers
- FPA-5550iZ2 · i-line steppers
- FPA-6300ES6a · DUV lithography systems
Sources
Wafer-level packaging equipment
Last updated: October 23, 2026