DFS8960
A fully automatic 300 mm surface planer with 2 spindles, 2 chuck tables and transfer and cleaning mechanisms.
Maker: DISCO · Official product page
Specifications
| Type | Diamond bit surface planing (2 spindles, 2 chuck tables, with transfer and cleaning) |
|---|---|
| Processing accuracy | TTV 3.0 µm or less, bump height variation 1.0 µm or less (5 mm square) |
| Dimensions | 1,400 × 3,356 × 1,870 mm |
Specifications as published by the maker. See the sources below.
Overview
DFS8960 is DISCO's fully automatic surface planer for 300 mm workpieces.
Ultra-precise planarization with a diamond bit flattens ductile materials such as metals, resins and composites of them with high accuracy, solving problems of height variation in bumps and of surface roughness.
It has two spindles, two chuck tables and transfer and cleaning mechanisms. Processing accuracy is a TTV of 3.0 µm or less, bump height variation of 1.0 µm or less within a 5 mm square chip, and a cut surface roughness of Ra 0.02 µm or less.
Key features
- Fully automatic, 2 spindles and 2 chuck tables
- Transfer and cleaning mechanisms
- Bump height variation of 1.0 µm or less
Applications
- Leveling bump heights (volume production)
Other wafer-level packaging equipment
- FPA-5520iV · Canon
- FPA-8000iW · Canon
- DAS8930 · DISCO
More from DISCO
Sources
Wafer-level packaging equipment
Last updated: October 23, 2026