Wafer-level packaging equipment
Wafer-level packaging (WLP) equipment forms package structures such as redistribution layers, bumps and molded fan-out structures while the chips are still in wafer or panel form, instead of packaging each die separately.
What it does
It includes lithography tools that cope with warped reconstituted wafers and large panels, and tools that planarize bumps and resin with high precision.
Products (4)
- FPA-5520iV · Canon
An i-line stepper for advanced packaging such as FOWLP. It reliably transfers heavily warped reconstituted substrates.
- FPA-8000iW · Canon
An i-line stepper for panel-level packaging that handles large 515 × 510 mm rectangular substrates with 1.0 µm resolution.
- DAS8930 · DISCO
A semi-automatic 300 mm surface planer that flattens metal and resin with ultra-high precision using a diamond bit.
- DFS8960 · DISCO
A fully automatic 300 mm surface planer with 2 spindles, 2 chuck tables and transfer and cleaning mechanisms.
Japanese makers in this category
Other back-end equipment
- Analog test systems (3)
- Backgrinders (9)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
Sources
Related calculators
Japanese equipment by category
Wafer-level packaging equipment
Last updated: October 23, 2026