VERSALINE® ICP
An ICP etching system on Plasma-Therm's VERSALINE platform. It handles a wide range of materials from compound semiconductors to metals and piezoelectrics, from R&D to volume production.
Maker: Plasma-Therm Japan · Official product page
Specifications
| Wafer size | 50 to 200 mm (expandable to 300 mm) |
|---|---|
| Type | ICP (inductively coupled plasma) etching, heated 2 MHz ICP source |
| Chamber configuration | Single-wafer load lock (LL) / cassette cluster (CX) |
| Target | III-V and II-VI compounds, Si-based materials, dielectrics, metals, piezoelectrics and others |
| Main applications | Power devices, photonics, wireless, MEMS, advanced packaging |
Specifications as published by the maker. See the sources below.
Overview
VERSALINE ICP is an ICP (inductively coupled plasma) etching system on Plasma-Therm's VERSALINE platform. Besides ICP etching, VERSALINE offers deep silicon etch (DSE), RIE, ion beam etch, PECVD and more on the same platform.
The ICP source runs at 2 MHz and is heated to improve process stability, suppress the first-wafer effect and extend the interval between cleanings. A key strength is the wide range of materials it handles: III-V compounds such as GaAs, InP and GaN, II-VI compounds, silicon-based materials, dielectrics, polymers, metals, metal oxides and nitrides, and piezoelectric materials.
It handles 50 to 200 mm wafers and can be expanded to 300 mm. There are single-wafer load lock (LL) and cassette cluster (CX) configurations, usable from R&D to volume production. Control is by Cortex, and endpoint detection by EndpointWorks, which uses optical emission or lasers.
Key features
- Heated 2 MHz ICP source improves process stability
- Handles a wide range of materials from compound semiconductors to metals and piezoelectrics
- Two configurations: load lock (LL) and cassette cluster (CX)
- Cortex control, EndpointWorks endpoint detection and SECS/GEM support
Applications
- Etching of power devices and compound semiconductors
- Photonics and wireless (RF) devices
- MEMS sensors and advanced packaging
Also listed under: SiC power semiconductor equipment, RF semiconductor (GaN/GaAs) equipment
Other dry etching equipment
- Tactras™ · Tokyo Electron (TEL)
- NE-550EX · ULVAC
- uGmni-200E · ULVAC
Sources
Dry etching equipment
Last updated: October 23, 2026