Dry etching equipment
Dry etching equipment removes material using plasma instead of liquid chemicals. Reactive ion etching (RIE) combines chemical reaction with ion bombardment to cut vertical features that follow the resist pattern.
What it does
Dry etching is used to pattern transistor gates, contacts, interconnect dielectrics and the deep holes and trenches of 3D NAND and DRAM.
Products (4)
- VERSALINE® ICP · Plasma-Therm Japan
An ICP etching system on Plasma-Therm's VERSALINE platform. It handles a wide range of materials from compound semiconductors to metals and piezoelectrics, from R&D to volume production.
- Tactras™ · Tokyo Electron (TEL)
Tokyo Electron's plasma etch system for 300 mm wafers. Since its launch in 2006, its face-to-face chamber layout has combined a small footprint with fast wafer transfer.
- NE-550EX · ULVAC
A dry etching system for R&D using magnetically assisted ICP (ISM). It has the same chamber as the uGmni-200E production tool.
- uGmni-200E · ULVAC
A cost-conscious dry etching system that scales from one chamber to multiple chambers.
Japanese makers in this category
- Plasma-Therm Japan · 1 product(s) listed
- Tokyo Electron (TEL) · 1 product(s) listed
- ULVAC · 2 product(s) listed
Other front-end equipment
Sources
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Last updated: October 23, 2026