FOUP300EX
Shin-Etsu Polymer's 300 mm in-process container designed for automation. Its single-molded construction maintains sealing and dimensional accuracy.
Maker: Shin-Etsu Polymer · Official product page
Specifications
| Types | FOUP (in-process container) |
|---|---|
| Wafer size | 300 mm (up to 25 wafers) |
| Related products | MW300GT, PANEL FOUP |
| Main applications | Wafer transport and storage in fabs |
Specifications as published by the maker. See the sources below.
Overview
FOUP300EX is Shin-Etsu Polymer's FOUP for 300 mm wafers. It is an in-process container designed for automated transport in fabs, safely transporting and storing up to 25 wafers of 300 mm.
It offers excellent sealing against particles and contamination from outside. Main parts use ESD (electrostatic discharge) materials, and a single-molded design prevents particle generation and maintains dimensional accuracy. Drying time after cleaning is also short.
Options include conductive side rails, barcode and RF ID tags, UV-cut windows, card cases and several colors. FOUPs are the basic containers that carry wafers between processes in 300 mm fabs, and their cleanliness and dimensional accuracy determine the reliability of automated transport.
Key features
- Transports and stores up to 25 wafers of 300 mm
- Tight sealing and ESD materials
- Single-molded design for low particles and dimensional accuracy
- Short drying time after cleaning
Applications
- In-process wafer transport and storage in 300 mm fabs
Other wafer carriers, foups and efems
- 300mm FOUP · Miraial
Sources
Equipment components and subsystems: more products
Last updated: October 23, 2026