Episode™ UL
Tokyo Electron's 300 mm etch platform with a choice of up to 12 chambers. Launched in 2020, it handles both dielectric and conductor etching.
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Reactive ion etching (RIE) |
| Chamber configuration | 4 to 12 chambers (face-to-face layout) |
| Main applications | Dielectric and conductor etching for advanced logic and memory |
Specifications as published by the maker. See the sources below.
Overview
Episode UL is a 300 mm etch platform that Tokyo Electron launched in 2020. The number of chambers can be chosen from 4 to 12, up to the industry's largest configuration of 12 chambers.
TEL pioneered the face-to-face chamber layout, and even with 12 chambers Episode UL greatly reduces the footprint per chamber in both the cleanroom and the utility area. Compared with earlier products it offers more work space and easier maintenance.
Multiple sensors and a high-speed control system on the transfer system and process modules feed TEL's Smart Tool function, which monitors tool operation and process conditions and enables autonomous process control through big data analysis. It supports both dielectric and conductor etching.
Key features
- Flexible choice of 4 to 12 chambers
- Face-to-face layout reduces footprint per chamber
- Big data analysis and autonomous process control with Smart Tool
- Larger work space for easier maintenance
Applications
- Dielectric etching for leading-edge logic and memory
- Conductor etching
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
Front-end equipment: more products
Last updated: October 23, 2026