M-8000 series
Hitachi High-Tech's 300 mm etching system for hard mask and silicon processing at the 32 nm generation and beyond.
Maker: Hitachi High-Tech · Official product page
Specifications
| Type | Microwave ECR plasma etching (coaxial chamber structure) |
|---|---|
| Wafer size | 300 mm |
| System configuration | Up to 4 chambers |
Specifications as published by the maker. See the sources below.
Overview
The M-8000 series is Hitachi High-Tech's conductor etching system. It handles hard mask and silicon processing at the 32 nm generation and beyond.
Through joint development programs (JDP) with leading device makers and material and equipment makers, it supports new processes such as double patterning and new materials such as high-k gate dielectrics and metal gates.
Hitachi's own microwave ECR etching chamber, with fast wafer temperature control, high-vacuum control and a coaxial chamber structure, gives excellent dimensional control and within-wafer uniformity. AEC and APC technologies based on Hitachi's own data collection, analysis and control system also help raise productivity.
Key features
- Microwave ECR method
- Coaxial chamber structure
- AEC/APC technology
- Up to 4 chambers
Applications
- Hard mask and silicon processing
- Processing of high-k / metal gates
Other polysilicon etchers
- 9000 series · Hitachi High-Tech
- Tactras™ · Tokyo Electron (TEL)
More from Hitachi High-Tech
Sources
Front-end equipment: more products
Last updated: October 23, 2026