Ashing equipment
Luminous NA series
ULVAC's ashing system that works with any wafer size. It covers everything from next-generation wafer processes to WLP.
Maker: ULVAC · Official product page
Specifications
| Type | Plasma ashing |
|---|---|
| Wafer size | Any wafer size (panel model up to 600 mm square) |
| Configuration | Wafer model / panel model |
| Main applications | Resist stripping after ion implantation, polymer removal, descum |
Specifications as published by the maker. See the sources below.
Overview
The Luminous NA series is ULVAC's ashing system. It is designed to work with any wafer size, covering everything from next-generation wafer processes to wafer-level packaging (WLP).
Besides wafer models, there is also a model for panels up to 600 mm square. It is used for resist stripping after ion implantation, polymer removal and descum.
Key features
- Design that works with any wafer size
- Panel model up to 600 mm square
Applications
- Resist stripping after ion implantation
- Polymer removal and descum
- WLP and panel-level packaging
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Sources
Front-end equipment: more products
Last updated: October 23, 2026