CS
A single-chamber sputtering system for R&D through small-scale production. Multiple cathodes allow stacked film deposition.
Maker: ULVAC · Official product page
Specifications
| Type | Single chamber, multiple cathodes |
|---|---|
| Substrate | Transfer up to Φ300 mm (deposition performance guaranteed up to Φ190 mm) |
| Load lock | Holds up to 5 trays |
Specifications as published by the maker. See the sources below.
Overview
CS is ULVAC's single-chamber sputtering system. It covers R&D through small-scale production and has been redesigned for ease of use, drawing on earlier process data and know-how.
It supports stacked sputtering with multiple cathodes, and recipe control deposits multilayer films automatically. Data logging is also available.
It can transfer substrates up to Φ300 mm, and deposition performance is guaranteed up to Φ190 mm. The cassette in the load lock chamber holds up to 5 trays, which a manipulator transfers automatically. It is used for R&D and small-scale production of electronic components.
Key features
- Stacked deposition with multiple cathodes
- Automatic multilayer deposition with recipe control
- Automatic tray transfer
Applications
- R&D and small-scale production of electronic components
Other sputtering equipment
- ENTRON-EX W300 · ULVAC
- ENTRON-EXX · ULVAC
- SME · ULVAC
- SRH · ULVAC
More from ULVAC
- CC-200 · PECVD equipment
- CCMT-D series · Vacuum gauges
- CME · PECVD equipment
- CME-200E · CVD equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- H83 / H84 · Diffusion furnaces
- HELIOT 900 series · Leak detectors
Sources
Sputtering equipment
Last updated: October 23, 2026