ENTRON-EX W300
A multi-chamber sputtering system qualified at many volume fabs. It is the earlier model before ENTRON-EXX.
Maker: ULVAC · Official product page
Specifications
| Configuration | Up to 10 processes (sputtering, pre-clean, heating, cooling) |
|---|---|
| Throughput | Mechanical throughput of 100 wph or more |
| Platform | Single, Tandem |
Specifications as published by the maker. See the sources below.
Overview
ENTRON-EX W300 is ULVAC's multi-chamber sputtering system. It supports production of many kinds of devices, including leading-edge logic, memory (DRAM, NAND, next-generation non-volatile memory) and packaging. It is the earlier model that preceded ENTRON-EXX.
Refined repeatedly for volume productivity, space efficiency and stability, it is a long-selling tool qualified at many volume fabs. It can carry up to 10 sputtering, pre-clean, heating and cooling processes, and ULVAC's new transfer robot achieves mechanical throughput of 100 wph or more.
It comes in a Single platform for dedicated processes and mini-fabs and a Tandem platform for mega-fabs, and has an EES system that monitors and manages tool status. It is used to form metal wiring, redistribution layers (RDL), protective masks, electrical connections and functional films.
Key features
- Up to 10 processes
- Mechanical throughput of 100 wph or more
- Single or Tandem
- EES system
Applications
- Metal wiring for logic and memory
- RDL formation
Also listed under: Sputtering equipment
Other pvd equipment
- EXIM™ · Tokyo Electron (TEL)
- LEXIA™-EX · Tokyo Electron (TEL)
- ENTRON-EXX · ULVAC
More from ULVAC
- CC-200 · PECVD equipment
- CCMT-D series · Vacuum gauges
- CME · PECVD equipment
- CME-200E · CVD equipment
- CS · Sputtering equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- H83 / H84 · Diffusion furnaces
Sources
PVD equipment
Last updated: October 23, 2026