CME
A tray-transfer PE-CVD system for volume production that deposits silicon-based insulating and barrier films.
Maker: ULVAC · Official product page
Specifications
| Plasma | 27.12 MHz high-density plasma |
|---|---|
| Maximum substrate size | 200 mm square (CME-200E), 300 × 400 mm (CME-400E), 500 mm square (CME-500E) |
| Cleaning | NF₃ + Ar plasma |
Specifications as published by the maker. See the sources below.
Overview
CME is ULVAC's PE-CVD system for volume production. It is suited to depositing silicon-based insulating and barrier films. With tray transfer, it handles a variety of substrates and offers excellent cost performance.
It supports high-density 27.12 MHz plasma processes and can deposit SiH₄-based SiO₂, SiNx, SiON and a-Si, and TEOS-based SiO₂ films. The chamber can be cleaned with NF₃ + Ar plasma.
Tray transfer allows deposition on substrates of many types and sizes. Maximum substrate size is 200 mm square for CME-200E, 300 × 400 mm for CME-400E and 500 mm square for CME-500E. It is used for power devices, LEDs, LDs and high-speed devices, OLEDs, solar cells and MEMS.
Key features
- Tray transfer for volume production
- Up to 500 mm square
- NF₃ + Ar cleaning
Applications
- Insulating and barrier films for power and compound devices
Other pecvd equipment
- CC-200 · ULVAC
- uGmni-200C · ULVAC
More from ULVAC
- CCMT-D series · Vacuum gauges
- CME-200E · CVD equipment
- CS · Sputtering equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- ENTRON-EX W300 · PVD equipment
- ENTRON-EXX · PVD equipment
- H83 / H84 · Diffusion furnaces
Sources
PECVD equipment
Last updated: October 23, 2026