T5833
A multi-function memory test system that can test both mobile DRAM and NAND flash in wafer test and package test.
Maker: Advantest · Official product page
Specifications
| Parallel testing | 2,048 devices in wafer test (1.5 times the previous model), 512 in package test |
|---|---|
| Test speed | Up to 2.4 Gbps (also for KGD testing) |
| Target | DRAM, NAND, MCP |
Specifications as published by the maker. See the sources below.
Overview
T5833 is Advantest's multi-function memory test system. It performs both wafer and package testing of the fast, high-capacity DRAM, NAND flash and MCPs (multi-chip packages) used in mobile products.
In wafer testing it tests 2,048 devices at once, 1.5 times the previous model, and in package testing it tests up to 512 devices at once at up to 2.4 Gbps. KGD (known good die) testing is also supported up to 2.4 Gbps.
Failure analysis (redundancy analysis), essential in wafer testing, runs about twice as fast as the previous model, and storing failed addresses is also faster, increasing the number of chips that can be repaired and improving yield. On the common AS platform, configurations range from ES for engineering to QSTH for production.
Key features
- Supports both DRAM and NAND
- 2,048 devices tested at once in wafer test
- About twice the failure analysis speed
Applications
- Testing of mobile DRAM and NAND
- KGD testing
Other memory test systems
More from Advantest
- 7038 System-Level Test System · Final test equipment
- B6700 series · Burn-in systems
- EVA100 · Analog test systems
- EXAVIS · Power semiconductor manufacturing equipment
- HA1200 · Wafer probers
- HA7200 · MEMS manufacturing equipment
- HA7300 · MEMS manufacturing equipment
- M4173 · Test handlers
Sources
Last updated: October 23, 2026