DFL7160
A fully automatic 300 mm laser saw known for non-thermal processing with a pulsed laser. It is widely used for full cutting of GaAs and DAF cutting after DBG.
Maker: DISCO · Official product page
Specifications
| Processing method | Ablation (short-pulse laser) |
|---|---|
| Wafer size | Φ300 mm |
| Dimensions | 1,200 × 1,550 × 1,800 mm |
Specifications as published by the maker. See the sources below.
Overview
DFL7160 is a fully automatic laser saw for 300 mm wafers from DISCO. Its strength is non-thermal processing with a pulsed laser, and it has been widely adopted for full cutting of GaAs and DAF cutting after DBG.
It has a mechanism that coats and cleans HogoMax, a water-soluble protective film that keeps laser debris from sticking to the wafer surface, preventing wafer contamination. A short-pulse laser gives high-quality cuts with little thermal strain or deformation.
It also handles low-k grooving, removal of TEGs on streets, and full cutting of Si and compound semiconductors. A kerf check function that automatically checks and corrects the laser cut position is standard.
Key features
- Non-thermal processing with a short-pulse laser
- HogoMax coating and cleaning
- Kerf check as standard
Applications
- Full cutting of GaAs
- DAF cutting after DBG
- Low-k grooving
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026