DFL7341
A 200 mm stealth dicing laser saw with high productivity for sapphire, LT and MEMS. It is a fully dry process that uses no water.
Maker: DISCO · Official product page
Specifications
| Processing method | Stealth dicing |
|---|---|
| Wafer size | Φ200 mm |
| Key feature | Fully dry process, height correction, wafer shape recognition |
Specifications as published by the maker. See the sources below.
Overview
DFL7341 is a fully automatic laser saw for 200 mm wafers from DISCO. It is widely used for LED sapphire substrates and silicon microphones.
Stealth dicing lets it singulate even brittle materials such as SiC and GaN without chipping. Because it is a completely dry process that uses no water, it suits devices that must not get wet, such as MEMS.
A height correction function that performs stealth dicing along the height of the wafer surface allows stable separation even of heavily warped wafers. A high-resolution sensor measures wafer shape so dies are singulated in the best processing area. Changing the laser oscillator for each material allows high-quality processing of sapphire, SiC, GaAs and others. DISCO is an alliance partner of Hamamatsu Photonics, which holds the patents for stealth dicing technology.
Key features
- Stealth dicing
- Fully dry process
- Height correction for warped wafers
- Oscillators matched to the material
Applications
- Singulation of sapphire and LT
- Singulation of MEMS
- Singulation of SiC and GaN
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026