DFL7262
DISCO's standard 300 mm laser saw that can carry an ultrashort-pulse laser. It is used for grooving low-k wiring layers and full cutting of composite structures.
Maker: DISCO · Official product page
Specifications
| Processing method | Ablation (ultrashort-pulse laser) |
|---|---|
| Wafer size | Φ300 mm |
| Handling | Switchable between wafer transfer and frame transfer |
Specifications as published by the maker. See the sources below.
Overview
DFL7262 is DISCO's standard-model laser saw with an ultrashort-pulse laser. It handles 300 mm wafers.
It can carry an ultrashort-pulse laser oscillator and optics, and automatically performs everything from HogoMax coating through dicing and cleaning. The coating and cleaning sections are separate, raising productivity.
The ultrashort-pulse laser minimizes thermal damage when grooving low-k wiring layers, and it also full-cuts Si wafers with DAF and composite structures such as Si/mold with high quality. By swapping parts and changing setup, it can switch between frame transfer, for wafers after grinding, and wafer transfer, for wafers before grinding. It is used to remove wiring layers and patterns in logic, HBM, NAND and DRAM.
Key features
- Ultrashort-pulse laser
- Automated from HogoMax coating to cleaning
- Switchable wafer and frame transfer
Applications
- Grooving of low-k wiring layers
- Removal of wiring layers in HBM and memory
- Full cutting of wafers with DAF
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026