DFL7362
DISCO's laser saw using stealth dicing (SD), which focuses the laser inside the wafer to form a modified layer. Throughput is 30% higher than the previous DFL7361.
Maker: DISCO · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Processing method | Stealth dicing (internal modified layer + separation by tape expansion) |
| Key feature | Kerf check and wafer thickness measurement, both wafer and frame transfer |
| Main applications | Singulation of thin wafers for stacked flash memory (SDBG) |
Specifications as published by the maker. See the sources below.
Overview
DFL7362 is DISCO's stealth dicing (SD) laser saw for Φ300 mm wafers. It focuses the laser inside the wafer to form a modified layer (SD layer) along the dicing lines that serves as the starting point for separation, and the dies are then separated by expanding the tape. Because the surface is not cut, little debris is generated, making it suited to contamination-sensitive workpieces.
Stacking many flash memory dies in a limited package space requires thin dies of high quality. DFL7362 is designed for processing thin silicon wafers and supports the SDBG (stealth dicing before grinding) process that DISCO has supplied to many memory makers.
An improved platform and faster processing axes shorten workpiece transfer time, raising throughput by 30% over the previous DFL7361. It handles both wafer and frame transfer and offers kerf check during processing and wafer thickness measurement. Sales began in December 2018.
Key features
- Stealth dicing (internal modified layer + separation by tape expansion)
- 30% higher throughput than the previous DFL7361
- Both wafer and frame transfer
- Kerf check during processing and wafer thickness measurement
Applications
- Singulation of thin dies for stacked flash memory
- SDBG (stealth dicing before grinding) process
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026