DFL7562
A multi-use 300 mm laser saw that can be fitted with either fixed optics or scanning optics.
Maker: DISCO · Official product page
Specifications
| Processing method | Ablation (fixed / scanning optics) |
|---|---|
| Wafer size | Φ300 mm |
| Processing examples | Grooving up to 330 µm wide; full cutting of Si, GaAs, SiC and InP |
Specifications as published by the maker. See the sources below.
Overview
DFL7562 is DISCO's multi-use laser saw that can carry a variety of oscillators and optics. It handles 300 mm wafers.
It can be fitted with fixed optics, which process through a fixed focusing lens, or scanning optics, which process while scanning the laser beam. It automatically performs everything from HogoMax coating through dicing and cleaning, with separate coating and cleaning sections for higher productivity.
With fixed optics it can groove low-k wiring and pattern layers and full-cut Si, GaAs, SiC, InP and metal substrates. With scanning optics it can groove up to 330 µm wide, form tapered or rounded cross sections, and cut narrow grooves.
Key features
- Choice of fixed or scanning optics
- Grooving up to 330 µm wide
- Full cutting of compound semiconductor wafers
Applications
- Low-k grooving
- Full cutting of compound semiconductors
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026