DFP8140
A dry polisher that removes backside grinding damage without slurry. It can be connected inline to DISCO grinders.
Maker: DISCO · Official product page
Specifications
| Wafer size | 4 / 5 / 6 / 8 inch |
|---|---|
| Polishing method | Dry polishing (no slurry or chemicals) |
| Configuration | Standalone tool (can be connected inline to DISCO grinders) |
| Main applications | Higher die strength and less warpage by removing grinding damage |
Specifications as published by the maker. See the sources below.
Overview
DFP8140 is a fully automatic polisher from DISCO. Using dry polishing without slurry, it removes the grinding damage layer left on wafers after backgrinding.
Removing the damage layer greatly reduces wafer breakage and warpage, improving die strength and yield. Because no chemical processing such as wet etching or CMP is needed, DISCO describes it as a process with low environmental impact.
Supported wafers are Φ4, 5, 6 or 8 inch (one size selected), and it uses a Φ300 mm dry polishing wheel. It can be used as a standalone tool, connected inline to a DISCO grinder, or added to one later.
Key features
- Dry polishing without slurry or chemicals
- Removing the grinding damage layer reduces wafer breakage and warpage
- Can be connected inline to DISCO grinders or retrofitted
- Spindle rated at 4.8 kW, 1,000 to 4,000 min⁻¹
Applications
- Stress relief after thinning Φ4 to 8-inch wafers
- Better die strength and yield on mid-size wafer lines
FAQ
Can DFP8140 be used for 300 mm wafers?
Supported wafers are Φ4, 5, 6 and 8 inch. For grinding and stress relief of 300 mm wafers in one tool, the DGP8761 grinder/polisher is the relevant model.
Other wafer polishers (back end)
More from DISCO
Sources
Wafer polishers (back end)
Last updated: October 23, 2026