DFP8160
A 300 mm dry polisher that removes the grinding damage layer without slurry, raising die strength and yield.
Maker: DISCO · Official product page
Specifications
| Type | Dry polishing (stress relief) |
|---|---|
| Wafer size | Φ200 / 300 mm (one size selected) |
| Spindle | 7.5 kW rated |
Specifications as published by the maker. See the sources below.
Overview
DFP8160 is DISCO's 300 mm dry polisher for chemical-free stress relief. It removes the grinding damage layer from the wafer backside without using any slurry.
It prevents wafer breakage and warpage and raises die strength and yield. As a dry process, it needs none of the chemical processing that comes with wet etching or CMP, which is expected to lower environmental impact and cost of ownership.
It can be added to an existing grinding process later, and the optional inline configuration with DFG8560 transfers wafers more safely.
Key features
- Dry polishing without slurry
- Prevents breakage and warpage
- Can be connected inline to a grinder
Applications
- Stress relief of thin wafers
Other wafer polishers (back end)
More from DISCO
Sources
Wafer polishers (back end)
Last updated: October 23, 2026