DME8061
A MUSUBI-compatible dry etcher that removes the grinding damage layer with plasma and then forms a gettering layer.
Maker: DISCO · Official product page
Specifications
| Type | Plasma stress relief + plasma gettering |
|---|---|
| Wafer size | Φ300 mm |
| Process gases | SF₆, Ar |
Specifications as published by the maker. See the sources below.
Overview
DME8061 is DISCO's MUSUBI-compatible dry etcher for raising die strength. Non-contact stress relief with plasma removes the grinding damage layer left on the ground surface, increasing die strength.
After stress relief, it can switch process gases and continue straight into gettering. It forms a gettering layer on the ground surface that traps impurities such as heavy metals, suppressing metal contamination of the device side.
It is part of MUSUBI, a cluster system that links several tools, and can be connected to a grinder/polisher and a wafer mounter to build a process that combines stress relief and gettering for chips after SDBG.
Key features
- Non-contact stress relief with plasma
- Continuous gettering
- Supports MUSUBI
Applications
- Higher die strength after SDBG
- Suppression of metal contamination
Other wafer polishers (back end)
More from DISCO
Sources
Wafer polishers (back end)
Last updated: October 23, 2026