DGP8761
A fully automatic grinder/polisher for Φ200 and 300 mm wafers. It performs backgrinding through stress relief in one tool and can thin wafers to below 25 µm.
Maker: DISCO · Official product page
Specifications
| Wafer size | 200 / 300 mm |
|---|---|
| Grinding method | In-feed grinding (Z1/Z2) + stress relief (Z3) |
| Configuration | 3 spindles, 4 chuck tables |
| Main applications | DBG/SDBG and wafer thinning |
Specifications as published by the maker. See the sources below.
Overview
DGP8761 is a fully automatic grinder/polisher from DISCO. It handles Φ200 mm and Φ300 mm wafers and performs both backgrinding and stress relief, which removes the damaged layer left by grinding, in one tool.
The tool has 3 spindles and 4 chuck tables. The Z1 and Z2 spindles perform in-feed grinding with diamond wheels, and the Z3 spindle can be set up for dry polishing, CMP, Poligrind or UltraPoligrind. DISCO states that it can stably thin wafers to below 25 µm.
Combined with the DFM2800 multi-wafer mounter, it can be run as a line that continues through DAF (die attach film) lamination. It supports four processes: DBG (dicing before grinding), SDBG, wafer thinning and stress relief.
Key features
- Grinding (Z1/Z2) and stress relief (Z3) in one continuous tool
- Z3 spindle configurable for dry polishing, CMP, Poligrind or UltraPoligrind
- Stable thinning to below 25 µm
- Links with DFM2800 for processing through DAF lamination
Applications
- Backgrinding in DBG/SDBG processes
- Thinning of ultra-thin wafers used in stacked memory and similar devices
- Higher die strength by removing the grinding damage layer (stress relief)
Also listed under: Wafer polishers (back end)
FAQ
What is the difference between DGP8761 and DFP8140?
DGP8761 is a grinder/polisher that combines grinding and polishing in one tool for Φ200/300 mm wafers. DFP8140 is a standalone dry polisher for Φ4 to 8-inch wafers that can be connected inline to a DISCO grinder.
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026