Wafer polishers (back end)
Polishers and etchers in the back end remove the thin damaged layer left on the wafer back side after grinding. This stress relief raises die strength and reduces warpage of thin wafers.
What it does
Methods include dry polishing without slurry, CMP, wet etching and plasma etching. Some tools also form a gettering layer that traps metal impurities away from the devices.
Products (4)
- DFP8140 · DISCO
A dry polisher that removes backside grinding damage without slurry. It can be connected inline to DISCO grinders.
- DFP8160 · DISCO
A 300 mm dry polisher that removes the grinding damage layer without slurry, raising die strength and yield.
- DGP8761 · DISCO
A fully automatic grinder/polisher for Φ200 and 300 mm wafers. It performs backgrinding through stress relief in one tool and can thin wafers to below 25 µm.
- DME8061 · DISCO
A MUSUBI-compatible dry etcher that removes the grinding damage layer with plasma and then forms a gettering layer.
Japanese makers in this category
- DISCO · 4 product(s) listed
Other back-end equipment
- Analog test systems (3)
- Backgrinders (9)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
Sources
Related calculators
Japanese equipment by category
Last updated: October 23, 2026