BIM300
A fully automatic measurement system that measures the 3D shape of many kinds of samples, such as Si, SiC and glass panels, with confocal optics.
Maker: Lasertec · Official product page
Specifications
| Type | Confocal optics (visible to NIR) |
|---|---|
| Samples | 2 to 12-inch wafers, 500 to 600 mm panels |
| Functions | Fully automatic measurement with SECS/GEM |
Specifications as published by the maker. See the sources below.
Overview
The BIM series is Lasertec's fully automatic wafer measurement system. It is a high-precision 3D shape measurement system that handles samples of many sizes.
Confocal optics measure width, height and depth with high accuracy. Beyond Si wafers, it also measures the surface shape of transparent materials, including compound semiconductors such as SiC and glass panels. Because it covers visible light through near-infrared (NIR), it can measure not only the wafer surface but also the shape of patterns underneath by seeing through the Si layer.
It handles 2 to 12-inch wafers and large 500 to 600 mm panels, with fully automatic measurement through SECS/GEM. It is used to measure the width and height of RDL on glass substrates for panel-level packaging and to measure the shape of patterns and defects inside Si wafers.
Key features
- Confocal optics
- Measurement through Si with visible to NIR light
- Handles wafers through large panels
Applications
- 3D measurement of compound semiconductors
- Measurement of RDL on panels
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Sources
Front-end equipment: more products
Last updated: October 23, 2026