DI2800
Hitachi's dark-field wafer defect inspection system with illumination and detection optics optimized by scattering intensity simulation.
Maker: Hitachi High-Tech · Official product page
Specifications
| Inspection method | Dark field |
|---|---|
| Target processes | Patterned wafers of 200 mm and smaller |
| Key feature | 0.1 µm sensitivity, 40 wafers per hour or more |
| Main applications | 100% inspection of IoT and automotive devices |
Specifications as published by the maker. See the sources below.
Overview
DI2800 is Hitachi High-Tech's dark-field wafer defect inspection system. It detects and controls defects on patterned samples in the manufacture of what Hitachi calls G&C (green and communication) devices made on φ100 to 200 mm wafers, such as SAW/BAW filters, MEMS and sensors, and power and analog devices.
Scattering intensity simulation optimizes the illumination and detection optics, giving high-sensitivity inspection of defects on patterned wafers in process. Detection sensitivity is equivalent to a 0.1 µm standard particle on a mirror wafer.
It can inspect very small chips of 0.3 mm square, and optimized inspection sequences process 40 or more 200 mm wafers per hour for defect inspection. It handles patterned and unpatterned φ100/150/200 mm wafers and is used for line process monitoring and screening of good devices.
Key features
- Hitachi High-Tech's own dark-field inspection method
- Detects 0.1 µm standard particles on mirror wafers
- 40 wafers per hour or more (200 mm)
- Supports φ100/150/200 mm, patterned and unpatterned
Applications
- Defect control for SAW/BAW, MEMS, sensors, power and analog devices
- Process monitoring and screening
More from Hitachi High-Tech
- 9000 series · Polysilicon etchers
- ArBlade® 5000 · Decapsulation and cross-sectioning equipment
- CG7300 · CD-SEMs
- CR7300 · Review SEMs
- CS5000 · CD-SEMs
- CT1000 · Review SEMs
- CV7300 · CD-SEMs
- DI4600 · Wafer inspection equipment
Sources
Front-end equipment: more products
Last updated: October 23, 2026