MAGICS M5640
A wafer defect inspection and review system that detects tiny defects from wafer manufacturing with 63 laser beams.
Maker: Lasertec · Official product page
Specifications
| Light source | 532 nm |
|---|---|
| Maximum detection sensitivity | 50 nm (PSL on mirror-polished wafers) |
| Inspection time | 22 minutes per wafer (300 mm, normal scan) |
Specifications as published by the maker. See the sources below.
Overview
MAGICS M5640 is Lasertec's wafer defect inspection and review system, announced in November 2008. It detects the tiny defects that next-generation processes require.
It offers higher sensitivity to killer defects from the wafer manufacturing process, such as PID, shallow scratches, COP and SF. 63 laser beams and a newly designed high-speed stage give high throughput. It can sensitively inspect mirror-polished wafers, epitaxial wafers, SOI wafers, quartz wafers and others.
It has fast, high-resolution review with confocal optics and can mark defect locations with a diamond tip without generating particles. Maximum detection sensitivity is 50 nm (PSL), and inspection time for 300 mm is 22 minutes. It is used for outgoing and incoming wafer inspection and for developing materials such as polishing and cleaning agents.
Key features
- 63 laser beams
- Maximum sensitivity of 50 nm
- Marking with a diamond tip
Applications
- Outgoing and incoming wafer inspection
- Development of polishing and cleaning materials
Other wafer substrate inspection equipment
- SBW series flatness and shape measurement systems · Kobelco Research Institute
- NC-80MAP · Napson
All wafer substrate inspection equipment and Japanese suppliers
More from Lasertec
- ABICS E120 · Mask inspection equipment
- ABICS E320 · Mask inspection equipment
- ACTIS A150 · Mask inspection equipment
- ACTIS A200HiT series · Mask inspection equipment
- ACTIS A300 series · Mask inspection equipment
- BASIC series · Mask inspection equipment
- BGM300 · TSV formation equipment
- BIM300 · Surface profilers
Sources
Wafer substrate inspection equipment
Last updated: October 23, 2026