SBW series flatness and shape measurement systems
Kobelco Research Institute's systems that measure wafer flatness and shape by line scanning. 3-point pin support and gravity sag calculation give accurate Bow and Warp.
Specifications
| Measurement method | Non-contact line scan |
|---|---|
| Measurements | Bow, Warp, GBIR (TTV), SFQR |
| Target processes | After slicing, lapping, etching and polishing |
| Main applications | Quality control of wafer shape |
Specifications as published by the maker. See the sources below.
Overview
The SBW series are Kobelco Research Institute's flatness and shape measurement systems. For 300 mm wafers, they measure thickness, Bow/Warp and GBIR (TTV: total thickness variation).
Measurement uses a capacitance method, measuring the shape of the wafer held in its natural state without vacuum chucking. Bow is defined as the deviation of the median surface from the reference plane at the wafer center, and Warp as the difference between the maximum and minimum deviations of the median surface from the reference plane.
An RBC (Resistivity Bias Canceler) option eliminates measurement errors caused by non-uniform wafer resistivity. A wafer flipping mechanism and SECS/GEM-compliant communication are also available as options. They are used for quality control that strictly evaluates wafer shape accuracy.
Key features
- Capacitance method, shape measurement without chucking
- Thickness, Bow/Warp and GBIR (TTV)
- RBC option eliminates errors from non-uniform resistivity
- Wafer flipping and SECS/GEM (optional)
Applications
- Quality control of flatness and warpage of 300 mm wafers
Other wafer substrate inspection equipment
- MAGICS M5640 · Lasertec
- NC-80MAP · Napson
All wafer substrate inspection equipment and Japanese suppliers
More from Kobelco Research Institute
- LTA-2200EP/F · Carrier lifetime measurement
Sources
Wafer substrate inspection equipment
Last updated: October 23, 2026