QUIXACE®-LV
KOKUSAI ELECTRIC's 300 mm large-batch EPI deposition system. Its wafer loading area is a vacuum load lock, reducing native oxide and contamination.
Maker: Kokusai Electric · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Large-batch vertical (vacuum load lock) |
| Key feature | Up to 1.25 times the lot capacity (vs. KOKUSAI's earlier tool) |
Specifications as published by the maker. See the sources below.
Overview
QUIXACE-LV is KOKUSAI ELECTRIC's large-batch EPI deposition system for 300 mm wafers. It brings together the company's core technologies in temperature control, automated transfer, vacuum and gas replacement, cooling and deposition, greatly shortening cycle time.
Its main feature is a wafer loading area built as a vacuum load lock. Because wafers can be sent into the reactor isolated from air, native oxide and contamination, which determine the quality of epitaxial growth, are greatly reduced for higher-quality deposition.
Lot capacity is up to 1.25 times that of KOKUSAI's earlier tool, and its strengths are uniform deposition in deep trench structures and accurate, high-quality deposition at low temperature. A health check function is available as an option.
Key features
- Wafer loading area with a vacuum load lock
- Greatly reduced native oxide and contamination
- Up to 1.25 times the lot capacity (vs. KOKUSAI's earlier tool)
- Accurate, high-quality deposition at low temperature
Applications
- Batch epitaxial growth
- Uniform deposition in deep trench structures
More from Kokusai Electric
- Advanced TSURUGI · ALD equipment
- Advanced TSURUGI Plus-Ⅲ · ALD equipment
- AdvancedAce®-II · LPCVD equipment
- MARORA® · Rapid thermal processing (RTP) equipment
- QUIXACE®-II · CVD equipment
- TANDUO · Rapid thermal processing (RTP) equipment
- TSURUGI-C²® · ALD equipment
- VERTEX Revolution · Oxidation furnaces
Sources
Front-end equipment: more products
Last updated: October 23, 2026