Advanced TSURUGI
KOKUSAI ELECTRIC's mini-batch deposition system with a new reactor for 3D stacked devices. Footprint is 10% smaller than the previous model.
Maker: Kokusai Electric · Official product page
Specifications
| Type | Mini-batch thermal process (thin film formation) |
|---|---|
| Wafer size | 300 mm |
| Key feature | Minimized-volume reactor, high exhaust capacity, smaller footprint (−10% vs. previous model) |
Specifications as published by the maker. See the sources below.
Overview
Advanced TSURUGI is KOKUSAI ELECTRIC's mini-batch deposition system. It is a thermal process system for next-generation devices, whose structures keep getting finer and more complex, combining difficult deposition with high productivity.
It uses a new reactor that achieves difficult deposition on 3D stacked devices. A wafer reactor optimized at minimum volume and high exhaust capacity reduce the loading effect and improve thickness uniformity, and higher replacement efficiency of reactant gases shortens deposition time.
It has a low-particle, high-speed wafer transfer system and, along with high productivity, a footprint 10% smaller than the previous model.
Key features
- New reactor for 3D stacking
- Reduced loading effect
- Footprint 10% smaller than the previous model
Applications
- Thin film formation for 3D stacked devices
Other ald equipment
- Advanced TSURUGI Plus-Ⅲ · Kokusai Electric
- TSURUGI-C²® · Kokusai Electric
- NT333™ · Tokyo Electron (TEL)
- TELINDY PLUS™ IRad™ · Tokyo Electron (TEL)
More from Kokusai Electric
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- MARORA® · Rapid thermal processing (RTP) equipment
- QUIXACE®-II · CVD equipment
- QUIXACE®-LV · Epitaxial growth equipment
- TANDUO · Rapid thermal processing (RTP) equipment
- VERTEX Revolution · Oxidation furnaces
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Sources
Last updated: October 23, 2026