Ulucus™ LX
TEL's laser debonding system that performs laser irradiation, wafer separation and cleaning in one tool. It removes silicon wafers after permanent bonding so they can be reused.
Specifications
| Type | Laser debonding + wafer separation + cleaning |
|---|---|
| Effect | Cuts pure water use by more than 90% compared with conventional methods |
| Base | LITHIUS Pro Z platform |
Specifications as published by the maker. See the sources below.
Overview
Ulucus LX is a laser debonding system from Tokyo Electron (TEL). With laser debonding technology developed by TEL, it performs laser irradiation, wafer separation and cleaning in one tool.
It combines advanced laser control and wafer separation with cleaning technology developed for NS and CELLESTA, on the platform of the widely shipped LITHIUS Pro Z coater/developer.
In permanent wafer bonding, it is intended to replace several steps such as backside grinding, polishing and chemical etching of the silicon wafer, and to reuse the removed silicon wafer. It cuts pure water use by more than 90% compared with conventional methods and also helps increase the number of good chips per wafer.
Key features
- Laser irradiation, separation and cleaning in one tool
- Replaces grinding and polishing steps
- Removed wafers can be reused
- More than 90% less pure water
Applications
- Wafer debonding in permanent bonding processes
Other hybrid bonding equipment
- Ulucus™ L · Tokyo Electron (TEL)
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
Last updated: October 23, 2026