Ulucus™ L
TEL's laser edge trimming system for high-density 3D integration. It trims the edge after bonding in a dry process that uses no pure water.
Specifications
| Type | Laser edge trimming (dry process) |
|---|---|
| Wafer size | 300 mm |
| Base | Coater/developer platform |
Specifications as published by the maker. See the sources below.
Overview
Ulucus L is TEL's laser edge trimming system for 300 mm high-density 3D integrated devices. It was developed by combining TEL's own advanced laser control unit with a platform widely proven in volume production on its coater/developers.
It offers front-end-level super-clean technology along with high reliability and productivity. Laser control gives high-quality cleaved surfaces and accurate, fast edge trimming.
Because no pure water is used during processing, it reduces pure water use, particle generation and wastewater. Edge trimming is done after the wafers are bonded, which also helps cut the number of steps before and after trimming.
Key features
- Laser edge trimming
- Dry process with no pure water
- Trimming after bonding reduces process steps
Applications
- Edge trimming in permanent wafer bonding
- 3D integrated devices
Other hybrid bonding equipment
- Ulucus™ LX · Tokyo Electron (TEL)
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Sources
Last updated: October 23, 2026