PVD equipment

ENTRON-EXX

ULVAC's multi-chamber deposition system. The successor to ENTRON-EX W300, it carries up to 12 PVD, pre-clean, heating and cooling modules.

Maker: ULVAC · Official product page

Specifications


TypePVD multi-chamber (Single / Tandem)
Chamber configurationUp to 12 modules
Main applicationsWiring and electrode films for logic, DRAM, NAND and next-generation non-volatile memory

Specifications as published by the maker. See the sources below.

Overview


ENTRON-EXX is ULVAC's multi-chamber deposition system for semiconductors. ULVAC began taking orders in December 2024 for it as the successor to ENTRON-EX W300, which was launched in 2005 and widely adopted. It keeps the productivity and flexibility of the previous model while strengthening data use and extensibility.

Process modules such as PVD, pre-clean, heating and cooling can be combined, with up to 12 modules installed. There are two platforms, Single with one transfer chamber (Core) and Tandem with two connected in series, chosen according to fab space and required productivity.

The design allows modules to be added or swapped quickly to meet changing requirements. Data collection and analysis functions that process large amounts of data in real time support yield improvement and preventive maintenance.

Key features


Applications


Also listed under: Sputtering equipment

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More from ULVAC


Sources


  1. ULVAC: ENTRON-EXX product page
  2. ULVAC news release (December 2, 2024)

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Last updated: October 23, 2026