HA1200
A prober that tests singulated dies under high-heat conditions. It selects good dies before chiplets are stacked, reducing yield loss.
Maker: Advantest · Official product page
Specifications
| Type | High-precision automatic probing of singulated dies |
|---|---|
| Temperature control | ATC (Active Thermal Control) linked to the tester |
| Target | High-end SoCs using chiplets |
Specifications as published by the maker. See the sources below.
Overview
HA1200 is a prober from Advantest. By testing at the die level under high heat, it helps raise productivity for high-end SoCs.
Chiplet technology used in high-end SoCs delivers high computing power, but stacking dies raises the risk of mixing good and defective dies, which can mean discarding many dies, substrates and interposers that were good.
High-precision automatic probing of singulated dies makes full-device testing, previously possible only at final test, possible before assembly, preventing good and defective dies from being stacked together. Advantest's own active thermal control linked to the tester, proven in package testing, handles the high heat of the dies.
Key features
- Full-device testing of singulated dies
- ATC linked to the tester
- Good-die selection before stacking
Applications
- KGD testing of chiplets
Other wafer probers
- Cellcia™ · Tokyo Electron (TEL)
- Precio octo™ · Tokyo Electron (TEL)
- Precio™ XL · Tokyo Electron (TEL)
- Prexa™ · Tokyo Electron (TEL)
- Prexa™ MS · Tokyo Electron (TEL)
- WDF™ 12DP+ · Tokyo Electron (TEL)
- UF3000EX-e · Tokyo Seimitsu (ACCRETECH)
More from Advantest
- 7038 System-Level Test System · Final test equipment
- B6700 series · Burn-in systems
- EVA100 · Analog test systems
- EXAVIS · Power semiconductor manufacturing equipment
- H5620 · Memory test systems
- HA7200 · MEMS manufacturing equipment
- HA7300 · MEMS manufacturing equipment
- M4173 · Test handlers
Sources
Last updated: October 23, 2026