DFL7362FH
A frame-transfer-only stealth dicing tool that quickly singulates ultra-thin silicon of 50 µm or less with high die strength.
Maker: DISCO · Official product page
Specifications
| Processing method | Stealth dicing (SDAG, SDTT) |
|---|---|
| Wafer size | Φ300 mm (frame transfer only) |
| Effect | About 30% higher UPH |
Specifications as published by the maker. See the sources below.
Overview
DFL7362FH is DISCO's laser saw dedicated to frame transfer. It processes wafers after ultra-thinning quickly and with high quality.
It can singulate ultra-thin silicon of 50 µm or less into chips quickly with high die strength. Besides silicon, it also handles transparent materials. Compared with earlier frame transfer tools, it shortens transfer and alignment time and raises the maximum X-axis speed and acceleration, improving UPH by about 30%.
It supports singulation of ultra-thin silicon with the SDAG process, in which stealth dicing is done after grinding. For workpieces that are hard to irradiate from the front, an automatic frame flipping mechanism can be added for the SDTT process, which irradiates from the back through the tape. Options include wafer thickness measurement and non-stop kerf check.
Key features
- Handles ultra-thin silicon of 50 µm or less
- About 30% higher UPH
- SDAG and SDTT processes
Applications
- Singulation of ultra-thin memory chips
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026