DFL7560L
A fully automatic laser lift-off system using a DPSS laser. It uses a laser to separate a material layer from its substrate, for applications such as micro LED.
Maker: DISCO · Official product page
Specifications
| Processing method | Laser lift-off (DPSS solid-state laser) |
|---|---|
| Wafer size | Φ6 inch |
| Dimensions | 2,000 × 1,810 × 1,800 mm |
Specifications as published by the maker. See the sources below.
Overview
DFL7560L is DISCO's fully automatic laser lift-off system using a DPSS (solid-state) laser. Laser lift-off is a method that separates a material layer formed on a substrate from that substrate by irradiating it with a laser. It handles Φ6-inch wafers.
DISCO's own optics process a wide focal range at the optimal power, suppressing wafer damage and peeling and leaving a very smooth surface after lift-off. Compared with typical gas laser lift-off tools, it greatly reduces maintenance time and stabilizes processing quality.
Spiral processing that moves in a constant direction lifts off quickly without wasted acceleration and deceleration. Energy varies little within the irradiated area, so small, numerous chips such as micro LEDs are processed with high yield.
Key features
- DPSS solid-state laser
- Wide focal range with DISCO's own optics
- Fast lift-off with spiral processing
Applications
- Laser lift-off for micro LED
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026