UFP600AS
Ebara's electroplating system that forms bumps, redistribution layers, vias and other structures on rectangular package substrates. A high-speed paddle method combines fast plating with within-substrate uniformity.
Maker: Ebara · Official product page
Specifications
| Supported substrates | Rectangular package substrates (panels) |
|---|---|
| Type | Electroplating (high-speed paddle method) |
| Key feature | Supports thin seed layers and many substrates; flexible platform |
| Main applications | Bumps, pillars, redistribution layers, through vias, fan-out |
Specifications as published by the maker. See the sources below.
Overview
UFP600AS is Ebara's electroplating system for rectangular substrates. It is a cleanroom tool that forms fine patterns such as bumps, redistribution layers and vias on rectangular package substrates, and it is increasingly adopted for advanced panel-level packaging.
Drawing on the high-speed paddle method and extensive process experience from its semiconductor wafer tools, it achieves fast plating and high within-substrate uniformity at the same time. It also supports plating on many kinds of substrates and on thin seed layers.
Its flexible platform can handle several processes in one tool, including bumps, pillars, redistribution layers, through vias and fan-out. It supports the manufacture of package substrates that are getting larger as chiplets spread.
Key features
- Electroplating for rectangular substrates (panels)
- High-speed paddle method combines fast plating with uniformity
- Supports thin seed layers and many substrates
- Bumps, pillars, redistribution layers and through vias in one tool
Applications
- Bumps and redistribution layers for panel-level packaging
- Through vias and fan-out
Other tsv formation equipment
- BGM300 · Lasertec
- VIANCA series · Lasertec
- ASE-Pegasus · SPP Technologies
- Synapse™ V / Synapse™ Z Plus · Tokyo Electron (TEL)
More from Ebara
- EV-M series · Vacuum pumps
- F-REX300X · Metal CMP equipment
- F-REX300XA · Oxide CMP equipment
- TND-Single (including TND-Single Plus) · Exhaust gas abatement systems
Sources
TSV formation equipment
Last updated: October 23, 2026