PHEMOS-X emission microscope C15765-01
A high-resolution emission microscope that locates failures by capturing light emission and heat caused by defects. Detectors can be chosen for emission, thermal and IR-OBIRCH analysis.
Maker: Hamamatsu Photonics · Official product page
Specifications
| Analysis technique | Emission analysis, thermal analysis, IR-OBIRCH (non-destructive) |
|---|---|
| Target | Wafers and packaged devices |
| Related models | Dual PHEMOS-X C16506-01 (analysis from both front and back) |
| Main applications | Locating failures (narrowing down the position) |
Specifications as published by the maker. See the sources below.
Overview
PHEMOS-X (C15765-01) is Hamamatsu Photonics' emission microscope. It is a failure analysis system that locates failures in semiconductor devices by capturing the faint light emission and heat generated at defects.
It can carry 2 ultra-high-sensitivity cameras covering different detection wavelength ranges from visible to near-infrared light. Up to 7 light sources can be installed, providing OBIRCH (optical beam induced resistance change), DALS (dual active lock-in sensing), EOP (electro-optical probing) and laser marker functions.
It has a superimpose function that overlays signals on high-resolution pattern images, a contrast enhancement function that improves low-contrast images, and TD Imaging (optional) for detecting defects in devices with complex structures, and an optical stage (X/Y ±20 mm, Z +80 mm) for many kinds of samples.
Key features
- Up to 2 ultra-high-sensitivity cameras (visible to near-infrared)
- Up to 7 light sources, OBIRCH, DALS and EOP
- Superimpose and contrast enhancement
- TD Imaging (optional)
Applications
- Locating failures in semiconductor devices (emission and thermal analysis)
- Analysis of leakage and short failures
Other failure analysis equipment
- NanoProber® NP8000 · Hitachi High-Tech
More from Hamamatsu Photonics
- Plasma process monitor C10346-01 · Process monitors (EPD/OES)
- Photoionizer L12645 · Ionizers (static elimination)
Sources
Last updated: October 23, 2026